Superior diffusion bonded materials

MKI offers a wide variety of materials for extremely varied applications ranging from automotive to aerospace, from medical to military, from bulk solids handling to paper and pulp molding, from architectural panels to acoustic treatments, and from oil wells to solar-powered Stirling cycle engines and hydrogen-powered fuel cells.

These materials are in turn produced from a wide variety of raw structures, including metal powders, fibers, wires, meshes, foils and plates. But what all of MKI's Dynapore® products have in common is one thing: our superior proprietary molecular diffusion-bonding process.

The diffusion bonding process

A diffusion-bond is formed between tangent metal surfaces when enough atoms or molecules migrate across the interface between them to create new metallurgical grains bridging the gap. Typically this occurs at elevated temperatures or pressures, or at a suitable combination of both. A common example of diffusion-bonding is metal parts sticking together during heat treatment, without the addition of any braze alloy or bonding agent. Diffusion-bonding is sometimes referred to as diffusion-welding, or as "sintering."

Using specially modified controlled atmosphere thermal processing equipment, MKI has developed a variety of commercially successful diffusion-bonding processes which may be adapted to the manufacture of the wide spectrum of materials we offer. Precise temperature and atmosphere control, scalable in-process isostatic pressure, and pre- or post-process calendering are combined to yield Dynapore® diffusion-bonded products which are viable for small to large scale production.